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\section{Grounding Scheme}
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\label{sec:Grounding}
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The grounding scheme followed during the TIB integration is scketched in Fig. \ref{fig:grounding},
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for an more complete description see~\cite{ref:grounding}.
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The high and low voltage return lines of each string
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are joined together at the mother cable head, then this
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point is connect to a gold plated copper sheet (called {\it corona}) fixed to the
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shell front flange. This sheet has been introduced to have a better quality soldering connections
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with respect to the aluminum cooling manifolds but it is equipotential to them. \\
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Other important ground connections are at the single module level. On the front-end hybrids
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of all the single sided modules and on the R-Phi double sided ones, a small
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gold plated copper pin (called {\it cometa}) is soldered on the low voltage common return,
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at the filtering capacitor level, and
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it is forced in contact with the module carbon fiber frame. In such a way the module frame is
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properly grounded resulting in a flat strip noise profile.
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Furthermore a connection has been done between the front-end hybrid return of end-flange side
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module and the cooling pipe close to it.\\
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The DOHM return and its shielding have been also connected to the {\it corona}. The DOHM
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return is also in contact with the mother cable return via the control cable ground lines.
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%\begin{figure}
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%\begin{center}
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% \includegraphics[width=0.85\textwidth]{Figs/grounding.pdf}
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%\end{center}
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%\caption{Scheme of the TIB shell grounding.}
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%\label{fig:grounding}
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%\end{figure}
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\begin{figure}
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\begin{center}
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\includegraphics[width=0.85\textwidth]{Figs/grounding2.pdf}
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\end{center}
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\caption{Scheme of the TIB shell grounding.}
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\label{fig:grounding}
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\end{figure}
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