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# Content
1 \section{Integration Tests}
2 \label{sec:Tests}
3
4 The CMS tracker has been designed to survive at ten years of LHC operation, with little or no chance
5 for maintenance. Its various components have been tested during the production
6 to meet stringent quality requirements. Few important problems have been spotted and
7 solved.\\
8 During the TIB/TID integration all the operations have been monitored step by step by a chain of tests
9 aimed at a final control of the components just after the installation described here.
10 A verification of the
11 shell overall quality and functionality in conditions similar to the final ones
12 has been later performed during the so-called burn-in tests~\cite{ref:burnin}.
13 The step by step tests are of particular importance
14 because in most cases it is very difficult and in some cases even dangerous
15 to replace a single faulty component when it is embedded in a fully equipped shell.
16
17 \subsection{Test Setup}
18 \label{sec:TestSetup}
19 The integration started well before the tracker
20 final data acquisition hardware and software
21 were available to the Collaboration. Integration tests thus had to
22 rely on prototype DAQ hardware and peripherals and software versions
23 that has been frozen to ensure consistent conditions during the
24 integration activities time-span, except few minor upgrades and bug
25 fixes.
26
27 \subsubsection{Hardware}
28 Here a brief account of the hardware used in DAQ for the integration
29 is given (see Fig.~\ref{fig:integration daq}).
30 \begin{figure}
31 \centering
32 \includegraphics[width=\textwidth]{Figs/integrationDAQ.pdf}
33 \caption{Hardware used for the integration DAQ.
34 \textbf{On the left:}
35 \textbf{1:} The analog opto-electrical converter.
36 \textbf{2:} Optical lines from the AOHs inside the (yellow) ribbon.
37 \textbf{3:} The signal is converted to electric.
38 \textbf{On the right:}
39 \textbf{1:} The signal converted to electric goes to FEDs through 2-poles LEMOs.
40 \textbf{2:} TSC provides trigger and clock to FEC through an (orange) optical fibre and
41 \textbf{3:} to FEDs though 4-poles LEMOs.
42 \textbf{4:} FEC also implements the 2-way communication towards CCUs and modules through a
43 (yellow) fibre ribbon.}
44 \label{fig:integration daq}
45 \end{figure}
46
47 \begin{description}
48 \item[TSC] The Trigger Sequencer Card or TSC~\cite{ref:tsc} generate the
49 40~MHz clock for the entire system and triggers as well, either
50 internally via software or by accepting external inputs. It has up to four
51 electrical clock/trigger outputs, enough to drive the FEDs used during the
52 integration, and an optical clock/trigger output for the FEC.
53 The TSC may also generate the reset and calibration signal that are
54 also encoded on the clock/trigger line.\\
55 \item[FED] The analog-to-digital conversion is done by special PCI FEDs,
56 %~\cite{bib:fedpci},
57 with electrical differential analog input, mounted on
58 PCI carrier boards and installed in an industrial PC.
59 The opto-electrical conversion of the analog signals coming from the module under test
60 is done externally by a 24-channel unit.
61 A setup containing 3 FEDs, with the electro-opical converter, is able
62 to readout 48 APV25; this is equivalent to 12 single sided modules
63 %(four complete strings)
64 or four double sided modules assemblies.
65 %(one string plus one module).
66 These figures are
67 pefectly suited for the tests during the integration.\\
68 Since the readout of the data from the APV25s is not
69 synchronous with the L1 trigger, a crucial capability of the FED is the
70 \textit{header finding}, i.e. the automatical tagging of the
71 analog data stream from APV25 pairs with respect to the idle
72 signals at its inputs. This is possible since the APV25s embeds the
73 analogue data stream within a {\em digital frame} made up of a leading
74 digital header and a trailing tick-mark.
75 %The peculiarity of the PCI FED
76 %with respect to the VME FED that will be used in the experiment, other than having electrical inputs
77 %instead of optical ones, is the timing system: the VME FED is able to
78 %perform the header finding on each input channel independently; the PCI FED has
79 %this capability only on the first channel of the eight available
80 %and assumes that the all input signals are synchronised.
81 %This makes the PLL-based time alignment procedure of crucial
82 %importance in a setup with PCI FEDs. Furthermore, PCI FEDs are not
83 %able to insert a programmable delay on their inputs and thus
84 %it is important that the clock/trigger connections from the TSC to
85 %FEDs have all the same delay. Last, PCI FEDs cannot perform an online
86 %pedestal subtraction and zero suppression (they cannot run in
87 %Processed Raw data nor in Zero Suppression mode).
88 \item[FEC] The special FEC used during the integration is the {\em FEC
89 mezzanine} also installed into a PC on a PCI carrier. It supports
90 the optical trigger/clock provided by the TSC and features an
91 optical output directly connected to DOHs on the DOHM.
92 \end{description}
93
94
95 \subsubsection{Software}
96 The software used to carry out integration tests is
97 based on the CMS general data acquisition framework
98 %{\em TrackerOnline}, the CMS
99 %tracker implementation of a more general software,
100 named xDAQ~\cite{ref:xdaq}.
101 % which is the official CMS DAQ framework.
102 In place of a database as in the
103 experiment version, the integration version of TrackerOnline uses a set of
104 xml files for all the configurations needed to perform a test run.
105 A description of the xml configuration files follows.
106 %, i.e. all the parameters needed by the devices and the
107 %software involved in the test run,
108 %\begin{figure}[bth!]
109 %\centering
110 %\includegraphics[width=\textwidth]{Figs/fecmodulexml_2.pdf}
111 %\caption{An example of data contained in fec.xml and module.xml files for one module.
112 %Part of the data is not shown for simplicity.}
113 %\label{fig:fecmodulexml}
114 %\end{figure}
115 The hardware and software configuration of the DAQ is written into the file
116 named daq.xml. It reflects the setup used for the test and has to be rarely changed
117 during the integration procedures. The system settings uploaded, and
118 read back for verification, by the FEC are contained into fec.xml.
119 The data decoding map (i.e., information needed to map each FED input to an
120 APV25 pair of a specific module) is written into module.xml.
121
122 %\begin{description}
123 %\item[Configuration of the DAQ hardware and software, daq.xml] The hardware
124 % and software configuration of the DAQ is written in a single xml file, which
125 % reflect the setup used for the test and has to be rarely changed
126 % during the integration procedures.
127 %\item[Configuration of the control system, fec.xml] The most important
128 % part of this configuration section is the settings the FEC must
129 % upload to the modules and AOHs and in general any configurable
130 % $I^2C$ device, before starting the data
131 %taking. Altough these settings are not specifically
132 % related to the control system, it is duty of the control system to
133 % write them to the devices' $I^2C$ registers and read them back for verification.
134 %\item[Configuration of the readout, module.xml] All other information needed by the DAQ to
135 %rearrange data coming from the FEDs is in module.xml that allows each
136 %FEDs input channel to be mapped to an APV pair of a specific module as
137 %identified by ring, CCU and $I^2C$ addresses (i.e. the correspondance
138 %between readout coordinates and Control System coordinates);
139 %Each row corresponds to an APV
140 %pair, an AOH laser, an optical fibre and a FED input.\\
141 %The second table of module.xml reassembles the information on a module basis.
142 %Here all the active modules are listed, with a row for every module.
143 %The Control System coordinates are repeated both in module.xml and fec.xml,
144 %so that they can be used as a pivot between the 3 tables.\\
145 %\end{description}
146
147 The tasks performed by the integration software are the following:
148 execution of the commissioning runs needed to optimal adjust of the
149 module parameters (preparation of fec.xml and module.xml); execution
150 of the test runs with complete and automated logging; fast analysis
151 for immediate feedback; archival of xml configuration files to log the
152 test conditions; archival of the raw data.
153 %\begin{figure}
154 %\centering
155 %\includegraphics[width=.9\textwidth]{Figs/integration_package.pdf}
156 %\caption{Scheme of the integration software.
157 %\textit{Arrows}: a relation.
158 %\textit{Gears}: an application.
159 %\textit{Mouse:} an interactive application.
160 %\textit{Sheet}: a file.}
161 %\label{fig:integration_package}
162 %\end{figure}
163 %Figure~\ref{fig:integration_package} shows a scheme of the relations between all the software
164 %components that will be described, the local files and the remote database.
165 This is achieved by using a specific set of components of integration
166 data acquisition software as summarized in the following.
167 \begin{description}
168 \item[FecTool.]
169 FecTool is GUI based front-end to two standalone
170 applications: FecProfiler
171 and ProgramTest, aimed to ease the creation of the device
172 description.
173 FecProfiler is able to detect
174 the devices connected to the CCUs and builds the fec.xml file needed by
175 TrackerOnline. FecTool takes care of checking that thedetected devices
176 corresponds to expected ones, i.e., per module, 4 or 6 APV25s, one
177 PLL, one AOH, and so on. ProgramTest allows the ring functionalities,
178 i.e. the redundancy, to be deeply tested.
179
180 The geographical identity of the strings under test must be
181 entered to allows for verification from FecTool of the matching
182 between the DCU Hardware Id read from each
183 module and the one declared in the module database. This
184 consistency check is crucial to spot possible errors in recording the
185 location where a module is mounted during the assembly. If the check
186 is passed, the fec.xml description file needed to go forth with
187 integration tests can be created.
188 %Hence tests proceed with the data
189 %readout from modules, which rely on .
190 \item[The Integration Package.]
191 %TrackerOnline as any xDAQ implementation requires an expert user as
192 %many run-specific parameters must be set and there is no input
193 %validation.
194 %\begin{figure}
195 %\centering
196 %\includegraphics[width=0.35\textwidth]{Figs/FedGuiMain.png}
197 %\caption{Main GUI window.}
198 %\label{fig:fedgui}
199 %\end{figure}
200 The integration setup is made more user-friendly by a special {\em
201 Integration Package}, a GUI based front end that interacts with
202 the data aquisition program to automatically set all relevant parameters
203 and to harvest all data at the end
204 of a run. The package is organized as a finite state machine by which
205 the user can cycle between the various states, i.e. the following integration test steps:
206 \begin{enumerate}
207 \item Daq initialisation (only once);
208 \item choice of the the desired run;
209 \item execution of the run via Daq program;
210 \item on run completion (i.e. after a given number of events), stop
211 data taking and execution of the fast data analysis;
212 \item presentation of the run outcome on summary GUIs;
213 \item on positive validation from the user, data are stored together
214 with run logs and data quality flags;
215 \item in case of commissioning runs, on positive validation from the
216 user, fec.xml and module.xml are updated accordingly to be used from
217 now on.
218 \end{enumerate}
219
220 %For every required run, the integration package shows the TrackerOnline output
221 %through some GUIs, so that the user can acknowledge the outcome of the run and give the approval
222 %for archiving the data or, in case of a commissioning run, for updating the parameter set.\\
223 %The TrackerOnline software computes the new parameter set for each commissioning run
224 %(except for the ``find connection'' run, as we'll see below) and writes
225 %it locally as a fec.xml file, which is retrieved by the integration package at need.\\
226 A main integration database has been setup for centralized archiving purposes,
227 was also installed. For later reference, if needed, the data analysis
228 can also be run on the archived files with validation outputs made
229 available through a web interface.
230 \end{description}
231
232 \subsection{Test Description}
233 \label{ref:test-description}
234
235 Each run type that can be choosen by the user corresponds to a
236 commissioning run or to a test run, as described below.
237
238 \begin{description}
239 \item[Find connections.] This commissioning run is used associate each
240 FED input channel to a module. The procedure, repeated in sequence
241 for all AOHs laser drivers, consists of switching on only a given
242 AOH laser driver at a time while checking the signal on all the FED inputs. If
243 the difference of the signal seen on a FED channel is above
244 a given threshold, the connection between that laser and input channel is tagged and stored
245 in module.xml.
246 \item[Time alignment.]
247 This commissioning run measures the appropriate delays to be later set
248 in the PLLs delay registers.
249 Doing so the different delays in the control and
250 readout chain are compensated, the clock arrives to the modules
251 synchronously, with a skew of the order of a few ns, and the APV25s
252 signal are properly sampled by the FEDs. This requires also the clock
253 to all the FEDs to be synchronous, but this is guaranteed
254 by using cables equal in length between the TSC and the FEDs.\\
255 The time alignment run uses the periodic tick mark signal issued by
256 the idle APV25s every 70 clock cycles. The APV25 signals are sampled by FEDs in
257 scope mode, i.e. without waiting for an header but continously,
258 sampling the inputs at the full clock frequency as with a 40~MSample/s
259 scope. The measurement is repeated after all the PLL delays are
260 increased by the minimum delay step, 25/24~ns. After 24 such cycles the
261 idle APV25 output and thus the tick mark signal also are measured with
262 an effective 960~MSample/s scope.
263 \begin{figure}
264 \centering
265 \includegraphics[width=.6\textwidth]{Figs/tickmark.pdf}
266 \caption{A tick mark sampled during a time alignment. The raising edge and the sampling point
267 are marked. In the picture are reported only those samplings around the tick mark, while
268 during the time alignment an interval of $1\,\mu\mathrm{s}$ is scanned.}
269 \label{fig:tick}
270 \end{figure}
271 The time differences between the variuos APV25 tick marks are a
272 measurement of the relative delays introduced by the connections and
273 can be used to compute the optimal delay to be set on each PLL for compensation.
274 The tick mark raising edge $t_R$ time is measured by taking the time corresponding to the highest
275 signal derivative (see Fig.~\ref{fig:tick}).
276 The best sampling point is considered $t_R+15\,\mathrm{ns}$, to avoid
277 the possible overshoot.
278 %[???This is important also later, when measuring the analogue data frame, as
279 %it allows measuring the signal coming from each strip after transient effects due to the signal
280 %switching between strips are over.???]\\
281 At the end of the procedure, all proposed adjustments to PLL delay
282 values are proposed to the user. If accepted the delays are written in
283 fec.xml. If the setup is correctly aligned in time, a further time
284 alignment procedure should not propose delay corrections greater than
285 $\sim 2$ns.
286 %It is worth noticing that by the time alignment procedure all APVs are
287 %made sampling synchronously, since in the integration setup AOH fibres
288 %and ribbons are all equal in length. This is not important during
289 %integration quality checks, as no external signal is ever measured,
290 %but it would be so in trying to detect ionising particles.
291 \item[Laser Scan.] By this commissioning run a scan of any bias and
292 gain value pair is done to determine the optimal working point for
293 each AOH.
294 The procedure requires a sucessfull time alignment since again tick marks are
295 sampled but in this case changing gain and bias values.
296 %
297 \begin{figure}[t!]
298 \begin{center}
299 \subfigure[The sampled tick mark top and baseline as a function of the laser driver's bias.]
300 {
301 \label{fig:gainscan_basetop}
302 \includegraphics[width=.45\textwidth]{Figs/gainscan_basetop.pdf}
303 }
304 \hspace{5mm}
305 \subfigure[The corresponding tick mark height for a given gain.]
306 {
307 \label{fig:gainscan_range}
308 \includegraphics[width=.45\textwidth]{Figs/gainscan_range.pdf}
309 }
310 \subfigure[A pictorial representation of a tick mark as produced by the APV25s (dotted)
311 and as transmitted by the lasers (solid) when the laser driver's bias is too
312 low (left), correct (centre) or too high (right), with the subsequent signal saturation.]
313 {
314 \label{fig:laserscan}
315 \includegraphics[width=.9\textwidth]{Figs/laserscan.pdf}
316 }
317 \caption{Plots computed during a gain scan run.}
318 \end{center}
319 \end{figure}
320 %
321 For each trigger sent to FEDs, the tick mark is sampled twice and all other samplings fall
322 on the baseline. The tick mark's top samples are used to estimate the higher limit of the signal
323 for a given gain/bias setting pair and the baseline samples provide an estimate of the lower limit.
324 For each gain setting the tick mark top samples and the baseline samples are measured as a
325 function of the bias, as shown in Fig.~\ref{fig:gainscan_basetop}. For
326 each bias setting their difference is the tick mark height, shown in Fig.~\ref{fig:gainscan_range},
327 that represents the dynamic range as a function of the bias.\\
328 The best bias setting for a given gain setting is taken as the one maximising the tick mark height keeping
329 the maximum and minimum not saturated, as pictorially represented in Fig.~\ref{fig:laserscan}.
330 The same measurement is done for each possible gain setting.
331 The best laser gain setting is the one providing an overall gain of
332 the optical chain as close as possible to the design one, 0.8~\cite{ref:gain}.
333 The overall gain is estimated from the slope of the curves of
334 Fig.~\ref{fig:gainscan_basetop} in their central section.
335 After the run is completed a set of values are proposed to the
336 user. Abnormal gain values may indicate a problem either on the AOH or
337 on the fibre and are investigated.
338 \item[VPSP Scan.]
339 This commissioning run is devoted to optimise the pedestal of
340 the APV25, i.e. the average output level in absence of any signal, with
341 respect to the dynamical range of the FEDs. This level is managed by a
342 specific APV25 register, know as {\em VPSP}, which controls a voltage
343 setting within the deconvolution circuitry. The procedure consists of
344 a scan of VPSP values while acquiring data frames from modules in the
345 standard way.
346 %%, i.e. trigger sent to the modules and FEDs in
347 %%``header finding'' mode.
348 In the final tracker operation the optimal VPSP setting correspond to a pedestal baseline placed
349 around 1/3 of the available dynamic range. This is a good compromise to keep
350 the baseline not too close the lower saturation value while leaving a good
351 range for particle signals, corresponding to $\sim 6$ MIP.
352 During the integration tests the only important point is to keep the baseline
353 away from the saturation levels; in such a way the module noise measurements will
354 not be affected by the wrong common mode subtractions which are present in case
355 of events with baseline saturation.
356 At the end of the run a set of values are proposed to the user for
357 approval and in case written in the relevant xml file.
358 \begin{figure}
359 \begin{center}
360 %\subfigure[Strip pedestals of a module in ADC counts vs.\ strip number.]
361 \subfigure[]
362 {
363 \label{fig:saturationpedestal}
364 \includegraphics[width=.45\textwidth]{Figs/saturation_pedestal.pdf}
365 }
366 \hspace{5mm}
367 %\subfigure[Strip noise of a module in ADC counts vs.\ strip number.]
368 \subfigure[]
369 {
370 \label{fig:saturationnoise}
371 \includegraphics[width=.45\textwidth]{Figs/saturation_noise.pdf}
372 }
373 \caption{Pedestal (left) and noise (right) vs. strip number for a 6 APV25 module.
374 The pedestals of strips after strip \#{}640 are low, approaching to the bottom of the
375 dynamic range. Their noise is therefore altered with respect to the not saturated
376 channels.}
377 \label{fig:saturation}
378 \end{center}
379 \end{figure}
380 The VPSP scan is not sistematically performed during the integration,
381 since the default VPSP setting is adequate in most of the
382 cases. Nevertheless, VPSP optimal values change considerably within
383 the APV25 population and are strongly temperature dependent and is
384 rather common to have a stuation in which the pedestal of few readout
385 channels approaches to the lower edge of dynamic range
386 (Fig.~\ref{fig:saturationpedestal}) resulting in a lower RMS (see
387 Fig.~\ref{fig:saturationnoise}). The VPSP scan allows for this issue to be
388 fixed.
389 \item[Pedestal and Noise Run.]
390 This is the main run type for qualifying the performances during
391 the integration. Tipically a bias of 400V is applied to the modules
392 under test to check for any possible overcurrent or breakdown.\\
393 Triggers are sent to the modules and FEDs work in ``header finding'' mode.
394 All the analogue frames from the modules are collected two analyses
395 are performed on these data: online, by the TrackerOnline
396 software; offline, in a way very similar to the final experiment algorythms.
397 %by using algorythms of the ORCA package~\cite{bib:orca}, the CMS
398 %reconstruction package at that time, now replaced by CMSSW.
399 The average value of the signal read on each strip is an estimate of
400 its pedestal, while the RMS is a good estimate of its noise, provided that the noise itself
401 is Gaussian, which is true to a first approximation. This value is often referred to as
402 \textit{raw noise}, as opposed to the \textit{common-mode subtracted
403 noise} (or CMN). The latter is the RMS computed after having
404 subtracted the {\em common noise}, i.e. the correlated noise-like fluctuation
405 common to a given group of channels (tipically an entire APV25).
406 The common mode noise subtraction method implemented in
407 TrackerOnline is similar to that performed by the final FEDs.\\
408 Because of the difference in gain between the various
409 optical links, noise comparison between different APV25 pairs requires a
410 normalization. This procedure relies on the digital
411 headers whose amplitude, being the same on each APV25, is used to
412 estimate of the relative gain of optical links so to apply an
413 appropriate correction. In such a way noise and gain are
414 simultaneously measured provided that the signal is not saturation both on low and high values.
415 The normalisation factor is chosen so as to bring the normalised
416 header height to 220 ADC counts, as measured in quality controls
417 during the module production. This allowed the scaled measurements to be easily
418 compared with those done during module production tests~\cite{ref:modtest}.\\
419 At the end of the run, pedestal and noise profiles and distributions
420 are shown to the user.
421 \begin{figure}[t!]
422 \centering
423 \includegraphics[width=0.6\textwidth]{Figs/noiseprofile.pdf}
424 \caption{Noise profile of a TIB Layer 3 module. X axis represent the strip index
425 and y axis represent the noise in ADC counts (or ADC count equivalent for the
426 normalised noise).}
427 \label{fig:noiseprofile}
428 \end{figure}
429 Figure~\ref{fig:noiseprofile} shows an example of the noise output:
430 the normalised raw noise and CMN and the uncalibrated CMN
431 for each strip are plotted against the strip index. The first 256 strips belong to the
432 first APV25 pair and are multiplexed to a single optical line and the strips from 257 to 512
433 belong to the second APV25 pair. It can be noted here that the
434 raw noise without normalisation reflecs the different gain of
435 optical links, this is corrected by the normalisation procedure.\\
436 If validated by the user, data are packed along with
437 possible comments and sent to the central archive system, where they are processed
438 again and made available on a web page.
439 %The system also automatically recognises where
440 %the modules where mounted by checking their DCU Hardware Id (which is written in the fec.xml file)
441 %in the construction database, this information is stored in the test table of
442 %the integration database and allows to build a geographical table of mounted modules with
443 %a link to a page containing all the tests performed for each module.\\
444 \end{description}
445
446 %%%%%%% aggiunta C.G.
447 The basic run types and tests described above are appropriately
448 combined according to the devices and/or the group of devices under test.
449 \begin{description}
450 \item[Single Module.] After a module is mounted, its basic
451 functionalities can be tested. In particular, a fast test on the
452 I$^2$C communication permits possible
453 electrical problems to be spotted in the module front-end electronics,
454 in the AOH or in the mother cable. For mother cable and AOH this is of
455 particular importance: an AOHs can be practically tested only
456 after the corresponding modules is mounted and this is the first
457 test which can spot possibly broken fibres; similarly for the MC, it
458 is very important to perform the test of as soon as possible. In
459 fact, a safe removal and replacement of either an AOH or the MC is a
460 difficult intervention possibly requiring the dismounting of many
461 modules already put in place. \\
462 Since the
463 I$^2$C test FecTool checks the identity of the components with respect
464 to the construction database an alarm issued in case of mismatch.
465 The results of the tests can then be
466 monitored through a web page.
467 \item[String]
468 When the third and last module or double sided assembly is mounted on
469 a string, all the commissioning runs described above are performed
470 just after the I$^2$C communication tests. The ``Find
471 connections'' run allows for the devices accessibility to be checked.
472 Afterwards a ``Time Alignement'' run, a ``Laser scan'' run and
473 finally a ``Pedestal and Noise'' run with bias voltage at 400V are performed. The
474 ``Laser scan'' run is done limiting the laser gain to the lower value
475 which is found to be enough for the integration setup needs.
476 \item[Control Ring and Redundancy.]
477 The control electronics can be fully tested only after complete
478 assembly of a shell. This last test forsees a check of the correct
479 operation of the ring and of the redundancy circuitry. A failure on a
480 CCU or a control cable can be immediatly spotted as it causes the
481 interruption of the ring; the communication with the other components
482 is then checked using ProgramTest. Finally the test of redundancy
483 circuitry is performed by-passing each CCU one by one and verifying
484 the correct response of the ring. The test is successful only if both
485 the primary and secondary circuits of the DOHM are working correctly
486 and if the CCUs are connected in the right order to the DOHM ports.
487 %%%%%%%% fine aggiunta C.G.
488 \end{description}
489
490 \section{Safety of operations}
491 The integration procedure posed many possible problems in the safety of operations,
492 from the routing of optical fibres to the handling of modules and each of these items
493 were addressed to minimise the risk of an accident. \\
494 For example
495 as the integration setup could not make use of the shell cooling system,
496 temperature measurements on the most sensible devices were done
497 to be sure not to damage any components when the system is powered up.\\
498 The component with the most stringent requirement on temperature is the AOH
499 and in particular the optical coupling of the pig-tail fibres to lasers.
500
501 \begin{figure}[t!]
502 \centering
503 \includegraphics[width=.5\textwidth]{Figs/ir.pdf}
504 \caption{IR picture of and AOH seen from below (laser side)
505 taken after a laser scan when bias and gain are maximum. The lasers reach a temperature
506 of $40^\circ \mathrm{C}$, while the highest recorded temperature $48^\circ \mathrm{C}$,
507 on the hybrid.}
508 \label{fig:ir}
509 \end{figure}
510
511 An infrared camera has been used to monitor the temperature during the integration
512 tests. Figure~\ref{fig:ir} show a shot taken just
513 after a laser scan performed on one string of double-sided modules.
514 This run proved to be the most thermal
515 stressing among the commissioning run performed, because at its end
516 all laser drivers have the maximum gain and the highest bias possible with a complete
517 signal saturation.\\
518 For this test a double-sided layer has been used. In this case the modules have
519 two back-to-back hybrids
520 and thus a higher power dissipation density with respect to the single-sided ones;
521 furthermore the AOH are equipped with three lasers.\\
522 Even in the most stressing condition and after a few minutes of settling,
523 the highest measured temperature on the lasers was $\sim 40^\circ \mathrm{C}$
524 (while it was $48^\circ \mathrm{C}$ on the hybrid).
525 These are safe temperatures~\cite{ref:lasertemp}
526 thus the integration tests could be performed without problems.