| 7 |
|
|
| 8 |
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\begin{figure}[!htb] |
| 9 |
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\begin{center} |
| 10 |
< |
\includegraphics[height=0.44\textwidth]{Figs/TIB-assembled.pdf} |
| 11 |
< |
\includegraphics[height=0.44\textwidth]{Figs/TID-disk.pdf} |
| 10 |
> |
\includegraphics[height=0.5\textwidth]{Figs/TIB-assembled.pdf} |
| 11 |
> |
\includegraphics[width=0.5\textwidth, angle=90]{Figs/TID-disk.pdf} |
| 12 |
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\end{center} |
| 13 |
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\caption{Half of TIB assembled and one TID disk on the left and on the right respectively. The 4 shells |
| 14 |
|
structure is visible for the TIB; the 3 rings structure is visible for the Disk.} |
| 65 |
|
The 6 TID disks are all identical and each one is made out of three rings. Each ring consists of |
| 66 |
|
a support mechanical structure made of an annular carbon fiber honeycomb, hosting modules and services on both sides to decrease the density and therefore providing a better accessibility during ring integration and disk assembly. |
| 67 |
|
|
| 68 |
< |
The TID+ and TID- are made out of three disks each, each disk being inserted, positioned and fixed, into a carbon fiber |
| 69 |
< |
cylinder called {\it Service Cylinder}. The Service Cylinder has several holes at the position of disk, in order to allow the connection of the power lines and to route out all the fibers of the disk. The service Cylinder is also used to connect mechanically TIB+/- and TID+/-, |
| 68 |
> |
Each TID+ and TID- is obtained by inserting, positioning and fixing each disk into a carbon fiber cylinder called {\it Service Cylinder}. Each Service Cylinder has several holes at the position of disk, in order to allow the connection of the power lines and to route out all the fibers of the disk. The service Cylinder is also used to connect mechanically TIB+/- and TID+/-, |
| 69 |
|
and to route out the services of the TIB and of the TID. |
| 70 |
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|
| 71 |
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%\begin{figure} |
| 78 |
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|
| 79 |
|
The cooling in the TIB/TID is distributed via aluminum circuits called cooling pipes |
| 80 |
|
that are bent into loops and soldered to inlet/outlet manifolds near a large flange. |
| 81 |
< |
The thermal connection between pipes and detector modules is made with Aluminum ledges which are |
| 81 |
> |
The thermal connection between pipes and sensor modules is made with Aluminum ledges which are |
| 82 |
|
precisely glued on the carbon fiber support structure and in good thermal contact with the pipes. |
| 83 |
|
On each ledge there are two threaded M1 holes onto which the modules are tightened. |
| 84 |
|
Precisely drilled slots, coaxial with the threaded holes, are the reference point where |
| 99 |
|
\end{figure} |
| 100 |
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|
| 101 |
|
|
| 102 |
< |
\subsection{The Detector Module} |
| 103 |
< |
The detector module design has been kept as simple as possible to ease their |
| 104 |
< |
mass production and integration. The silicon sensor~\cite{ref:mask}\cite{ref:sensors} |
| 105 |
< |
is glued on a carbon fiber support |
| 107 |
< |
frame which also holds the front-end electronics hybrid. The sensor is aligned, during its |
| 108 |
< |
gluing, using a reference system made by the frame aluminum insets. Since the insets are the |
| 109 |
< |
reference points to mount the module on the shell, this choice guarantee the best reproducibility |
| 102 |
> |
\subsection{The Silicon Module} |
| 103 |
> |
The silicon module design has been kept as simple as possible to ease their |
| 104 |
> |
mass production and integration. In TIB and TID the module hosts a single silicon sensor~\cite{ref:mask}\cite{ref:sensors} glued on a carbon fiber support |
| 105 |
> |
frame which also holds the front-end electronics hybrid. The sensor is aligned with respect to the same frame aluminum insets that are used to mount the module on the shell: this choice guarantee the best reproducibility |
| 106 |
|
of the sensor position in the global shell coordinate system.\\ |
| 107 |
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The readout chip |
| 108 |
|
pitch (44$\mu$m) is matched to the sensor pitch via an aluminum deposited glass substrate |
| 142 |
|
\end{figure} |
| 143 |
|
|
| 144 |
|
|
| 145 |
< |
Sensors of the TIB and TID have respectivelly strip lengths of 12 cm and between 9 and 11 cm for TID. |
| 145 |
> |
Sensors of the TIB and TID have respectivelly strip lengths of 12 cm and between 9 and 11 cm for TID, are 320 $\mu$m thick |
| 146 |
|
%{\it verify these lenghts } |
| 147 |
|
%and of the four innermost rings of the TEC |
| 148 |
|
and pitches vary between 80 $\mu$m and 120 $\mu$m. |
| 149 |
< |
These detectors are made of a single sensor 320 $\mu$m thick. |
| 149 |
> |
%These silicon are made of a single sensor 320 $\mu$m thick. |
| 150 |
|
|
| 151 |
|
% LD: is this relevant for the TIB/TID integration paper ? |
| 152 |
|
% ========================================================== |
| 157 |
|
%(longer strips), a silicon thickness of 500 $\mu$m has been chosen for these larger |
| 158 |
|
%detectors. \\ |
| 159 |
|
|
| 160 |
< |
All Silicon Strip Sensors are of single sided type and produced from $<100>$ |
| 161 |
< |
Float-zone type 6 inches wafers. |
| 160 |
> |
%All Silicon Strip Sensors are of single sided type and produced from $<100>$ |
| 161 |
> |
%Float-zone type 6 inches wafers. |
| 162 |
|
|
| 163 |
< |
Double sided detectors are |
| 163 |
> |
Double sided modules are |
| 164 |
|
realized simply gluing back to back two independent single sided modules: to |
| 165 |
|
obtain a coarser but adequate resolution on the longitudinal coordinate the so |
| 166 |
|
called “Stereo” module has the sensor tilted of 100mrad with respect to the |
| 173 |
|
%the Detector modules will be cooled to a temperature which, on the Silicon Sensor, |
| 174 |
|
%will reach about -10$^\circ C$.\\ |
| 175 |
|
|
| 176 |
< |
\subsection{The Front-end Electronics} |
| 176 |
> |
%\subsection{The Front-end Electronics} |
| 177 |
|
The signals coming from each strip are processed by front-end readout chips |
| 178 |
|
(APV25) mounted on the multilayer kapton hybrid circuit. The APV25~\cite{ref:apv} |
| 179 |
|
is a 128 channel chip built in radiation hard 0.25 $\mu$m |
| 208 |
|
70 clock cycles when there is no data to read out. |
| 209 |
|
The APV25 electrical signals are then converted to optical |
| 210 |
|
ones in dedicated Analog-Opto Hybrids (AOH\cite{ref:aoh}) few centimeters away from |
| 211 |
< |
the detector, and transmitted to the counting room by means of multi-mode |
| 211 |
> |
the module, and transmitted to the counting room by means of multi-mode |
| 212 |
|
optical fibers~\cite{ref:opto}, where they are digitized~\cite{ref:fed}. |
| 213 |
|
The LHC 40MHz clock, which |
| 214 |
|
drives the APV25 sampling can be delayed at the single module level by |
| 220 |
|
two constant current sources and a temperature sensor. It |
| 221 |
|
monitors two sets of thermistors, one on the sensor |
| 222 |
|
and one on the hybrid, its own internal temperature, the |
| 223 |
< |
silicon detector bias current and the two (1.25 V and |
| 223 |
> |
silicon sensor bias current and the two (1.25 V and |
| 224 |
|
2.5 V) low voltages.\\ |
| 225 |
|
Each DCU has a unique hardware identification |
| 226 |
|
number (called \textit{DCU Hardware ID}) that can also be read through the $I^2C$ interface. |
| 229 |
|
stores the module information, |
| 230 |
|
and the online databases, storing information during data taking. |
| 231 |
|
|
| 232 |
< |
\subsection{The off-detector Electronics} |
| 232 |
> |
\subsection{The off-Module Electronics} |
| 233 |
|
\subsubsection{AOH} |
| 234 |
|
|
| 235 |
|
The electric to optical conversion is done by radiation hard lasers~\cite{Gill:2005ui}. |
| 236 |
|
These devices sit on a dedicated board, called Analog Opto-Hybrid, which is |
| 237 |
< |
fixed on a ledge glued on the cooling pipe very close to the detector module. |
| 237 |
> |
fixed on a ledge glued on the cooling pipe very close to the silicon module. |
| 238 |
|
The electrical signals arrive to the AOH through the module front-end hybrid |
| 239 |
|
kapton cable tail which carries the AOH power lines too. |
| 240 |
|
The AOH can hold up to three lasers (only two are mounted for single sided 4 APV chips |
| 256 |
|
|
| 257 |
|
\subsubsection{CCU} |
| 258 |
|
|
| 259 |
< |
The Silicon Strip Tracker Detector Modules are controlled by a set of signals |
| 259 |
> |
{\it manca referenza } |
| 260 |
> |
|
| 261 |
> |
The module electronics is controlled by a set of signals |
| 262 |
|
(clock, trigger, $I^2C$ lines) which are dispatched to them via a |
| 263 |
|
token ring structured circuitry ("control ring"). |
| 264 |
|
CCUs are the nodes of this structure. They receive instructions from the external |
| 267 |
|
for example to read the Status Register of the CCU or to raise its output PIA reset lines. |
| 268 |
|
While in the latter case |
| 269 |
|
commands are translated to the $I^2C$ protocol and forwarded to the |
| 270 |
< |
other devices located on the detector modules or AOH; in case of |
| 270 |
> |
other devices located on the sensor modules or AOH; in case of |
| 271 |
|
a reply from the $I^2C$ device, the reverse process is done by the CCU, which addresses the |
| 272 |
|
information to the FEC. |
| 273 |
|
The CCU device sits on a CCU-Module (or CCUM) which carries also buffering chips and a DCU. |
| 275 |
|
|
| 276 |
|
\subsubsection{Mother Cable} |
| 277 |
|
|
| 278 |
+ |
{\it manca referenza } |
| 279 |
+ |
|
| 280 |
+ |
|
| 281 |
|
In the TIB/TID a multi-layer kapton copper cable ("Mother Cable", see Fig.~\ref{fig:fotomc}) |
| 282 |
|
is mounted on the carbon fiber shell underneath the |
| 283 |
|
modules. A full description of the mother-cable can be found in~\cite{ref:mc}. |
| 313 |
|
|
| 314 |
|
\subsubsection{Control Ring} |
| 315 |
|
\label{fig:ctrlring} |
| 316 |
< |
A control ring is an electro-optical circuitry that interfaces the detector to the |
| 316 |
> |
|
| 317 |
> |
{\it manca referenza } |
| 318 |
> |
|
| 319 |
> |
A control ring is an electro-optical circuitry that interfaces the front-end electronics to the |
| 320 |
|
tracker control system. |
| 321 |
|
The control ring is optically driven by a FEC (Front-End Controller) module~\cite{ref:opto} |
| 322 |
|
located outside the tracker in the experiment control room. |
